Electronics housing assembly
US-2024397637-A1 · Nov 28, 2024 · US
Bead foam compression molding method for low density product
US8961844B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961844-B2 |
| Application number | US-201213545532-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 10, 2012 |
| Priority date | Jul 10, 2012 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
Disclosed is a method for molding a foamed article, such as a midsole or outsole for footwear, in which a desired amount of thermoplastic polyurethane foam beads are placed in a compression mold in the shape of the article and the mold is brought to a peak temperature of from about 130° C. to about 180° C. over a period of from about 300 to about 1500 seconds, then cooled to from about 5° C. to about 80° C. over a period of from about 300 to about 1500 seconds within about 30 seconds after the peak temperature is reached. The foamed article made by the method has a density of from about 0.1 to about 0.45 g/cm 3 .
First claim
Opening claim text (preview).
What is claimed is: 1. A method for molding a foamed article, comprising: placing a desired amount of thermoplastic polyurethane foam beads in a compression mold in the shape of an article, wherein the thermoplastic polyurethane foam beads have a density of from about 0.01 to about 0.3 g/cm 3 ; closing the mold; bringing the mold to a peak temperature of from about 130° C. to about 180° C. over a period of from about 300 to about 1500 seconds; cooling the mold to a temperatu…
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Human Necessities · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B29C43/18Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US8961844B2 cover?
- Disclosed is a method for molding a foamed article, such as a midsole or outsole for footwear, in which a desired amount of thermoplastic polyurethane foam beads are placed in a compression mold in the shape of the article and the mold is brought to a peak temperature of from about 130° C. to about 180° C. over a period of from about 300 to about 1500 seconds, then cooled to from about 5° C. to…
- Who is the assignee on this patent?
- Baghdadi Hossein A, Schiller Denis, Yu Sui-Chieh J, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B29C43/18. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).