Co-packaged optics assemblies
US-2024310578-A1 · Sep 19, 2024 · US
Production method of optical waveguide
US8961839B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961839-B2 |
| Application number | US-4835208-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2008 |
| Priority date | May 25, 2007 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
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A production method of an optical waveguide includes: preparing a laminated body that includes a first clad layer and at least a core layer laminated on the first clad layer; forming a light propagating optical waveguide core by cutting the core layer by use of a dicing saw from a side where the core layer is laminated while intruding an edge of a blade portion of the dicing saw into the first clad layer so as to partially cut the first clad layer; and embedding at least a cut portion of the laminated body with a second clad layer.
First claim
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What is claimed is: 1. A production method of an optical waveguide, comprising: preparing a laminated body that comprises a first clad layer having a thickness of 30 μm to 150 μm and at least a core layer laminated on the first clad layer; forming a light propagating optical waveguide core by cutting through the core layer by use of a dicing saw from a side where the core layer is laminated while intruding an edge of a blade portion of the dicing saw into the first clad layer so…
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- G02B6/13Primary
Physics · mapped topic
Physics · mapped topic
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- What does patent US8961839B2 cover?
- A production method of an optical waveguide includes: preparing a laminated body that includes a first clad layer and at least a core layer laminated on the first clad layer; forming a light propagating optical waveguide core by cutting the core layer by use of a dicing saw from a side where the core layer is laminated while intruding an edge of a blade portion of the dicing saw into the first …
- Who is the assignee on this patent?
- Suzuki Toshihiko, Shimizu Keishi, Yatsuda Kazutoshi, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification G02B6/13. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).