Imprinted multi-layer micro-structure method with multi-level stamp
US-9215798-B2 · Dec 15, 2015 · US
US8961835B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961835-B2 |
| Application number | US-201414199532-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2014 |
| Priority date | Aug 26, 2009 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer.
Opening claim text (preview).
The invention claimed is: 1. A method for forming a conductive pattern, comprising the steps of: coating a conductive metal ink composition on a roller; forming a pattern of the ink composition corresponding to the conductive pattern on the roller, by contacting the roller with a cliché which has intaglio pattern corresponding to the conductive pattern; transferring the pattern of the ink composition on the roller onto a substrate; and sintering the transferred pattern on th…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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