Resin composition, semi-cured thermally conductive film using same, circuit board and adhesive sheet
US-2018298186-A1 · Oct 18, 2018 · US
US8961823B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961823-B2 |
| Application number | US-201213721024-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2012 |
| Priority date | Jul 5, 2012 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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The compound represented by formula (1). For example, the rings A 1 , A 2 , A 3 and A 4 are 1,4-phenylene, Z 1 and Z 2 are alkylene having 1 to 10 carbons in which at least one —CH 2 — may be replaced by —O— or —CH═CH—; L 1 , L 2 and L 3 are a single bond, —COO— or —CH═CH—; G 1 and G 2 are —O—; s, t and u are 0 or 1 ; and P 1 and P 2 is the group (P-1), the group (P-2) or the group (P-3). M 1 and M 2 are hydrogen or methyl.
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What is claimed is: 1. A compound represented by formula (1): wherein the ring A 1 , the ring A 2 , the ring A 3 and the ring A 4 are independently 1,4-cyclohexylene, 1,4-cyclohexenylene, 1,4-phenylene, naphthalene-1,2-diyl, naphthalene-1,3-diyl, naphthalene-1,4-diyl, naphthalene-1,5-diyl, naphthalene-1,6-diyl, naphthalene-1,7-diyl, naphthalene-1,8-diyl, naphthalene-2,…
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Physics · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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