Methods for chemical mechanical polishing and forming interconnect structure
US-2024290629-A1 · Aug 29, 2024 · US
CMP compositions with low solids content and methods related thereto
US8961807B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961807-B2 |
| Application number | US-201313841344-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2013 |
| Priority date | Mar 15, 2013 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
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Disclosed are a polishing composition and method of polishing a substrate. The composition has low-load (e.g., up to about 0.1 wt. %) of abrasive particles. The polishing composition also contains water and at least one anionic surfactant. In some embodiments, the abrasive particles are alpha alumina particles (e.g., coated with organic polymer). The polishing composition can be used, e.g., to polish a substrate of weak strength such as an organic polymer. An agent for oxidizing at least one of silicon and organic polymer is included in the composition in some embodiments.
First claim
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The invention claimed is: 1. A polishing composition comprising: (a) 0.001 wt. % to 0.1 wt. % of abrasive particles coated with a polymer, (b) an anionic surfactant comprising diphenyl oxide disulfonate, and (c) water, wherein the composition has a pH of about 1.5 to about 5. 2. The polishing composition of claim 1 , wherein the abrasive particles comprise alumina, fumed silica, silica, and/or zirconia. 3. The polishing composition…
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Frequently asked questions
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- What does patent US8961807B2 cover?
- Disclosed are a polishing composition and method of polishing a substrate. The composition has low-load (e.g., up to about 0.1 wt. %) of abrasive particles. The polishing composition also contains water and at least one anionic surfactant. In some embodiments, the abrasive particles are alpha alumina particles (e.g., coated with organic polymer). The polishing composition can be used, e.g., to …
- Who is the assignee on this patent?
- Cabot Microelectronics Corp
- What technology area does this patent fall under?
- Primary CPC classification C09G1/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).