Building material manufacturing apparatus
US-12246469-B2 · Mar 11, 2025 · US
Die-member-cleaning method and apparatus
US8961697B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961697-B2 |
| Application number | US-52091607-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 26, 2007 |
| Priority date | Dec 27, 2006 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Abstract
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A method for cleaning a die member having molding grooves and moldable-ceramic-material-supplying holes communicating with the molding grooves, by removing a binder-containing moldable ceramic material from the die member after used for molding the moldable ceramic material, comprising the steps of spraying a high-pressure fluid to a surface of the die member on the side of moldable-material-supplying holes, and then spraying a high-pressure fluid to a surface of the die member on the side of molding grooves, thereby removing the moldable ceramic material.
First claim
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What is claimed is: 1. A method for cleaning a die member having molding grooves and moldable-ceramic-material-supplying holes communicating with the molding grooves, after used for molding a binder-containing moldable ceramic material, consisting essentially of the step of removing said binder-containing moldable ceramic material from said die member by first spraying a high-pressure fluid to a surface of said die member on the side of said moldable-material-supplying holes substa…
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Frequently asked questions
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- What does patent US8961697B2 cover?
- A method for cleaning a die member having molding grooves and moldable-ceramic-material-supplying holes communicating with the molding grooves, by removing a binder-containing moldable ceramic material from the die member after used for molding the moldable ceramic material, comprising the steps of spraying a high-pressure fluid to a surface of the die member on the side of moldable-material-su…
- Who is the assignee on this patent?
- Sugio Naoki, Hitachi Metals Ltd
- What technology area does this patent fall under?
- Primary CPC classification B28B7/386. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).