Semiconductor device and fabrication method thereof
US-12159906-B2 · Dec 3, 2024 · US
US8961687B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961687-B2 |
| Application number | US-55143009-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 31, 2009 |
| Priority date | Aug 31, 2009 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Disclosed embodiments include methods of fabricating a semiconductor layer or device and devices fabricated thereby. The methods include, but are not limited to, providing a substrate having a cubic crystalline surface with a known lattice parameter and growing a cubic crystalline group III-nitride alloy layer on the cubic crystalline substrate by coincident site lattice matched epitaxy. The cubic crystalline group III-nitride alloy may be prepared to have a lattice parameter (a′) that is related to the lattice parameter of the substrate (a). The group III-nitride alloy may be a cubic crystalline In x Ga y Al 1-x-y N alloy. The lattice parameter of the In x Ga y Al 1-x-y N or other group III-nitride alloy may be related to the substrate lattice parameter by (a′)=√2(a) or (a′)=(a)/√2. The semiconductor alloy may be prepared to have a selected band gap.
Opening claim text (preview).
What is claimed is: 1. A method of fabricating a semiconductor layer comprising: providing a substrate having a cubic crystalline surface with a known lattice parameter (a); and growing a cubic crystalline group III-nitride alloy layer on the cubic crystalline substrate surface by coincident site lattice matched epitaxy, wherein the cubic crystalline group III-nitride alloy is prepared to have a lattice parameter (a′) that is related to the lattice parameter (a) wherein (a′) is…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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