A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
US8961669B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8961669-B2 |
| Application number | US-201314090851-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 26, 2013 |
| Priority date | Dec 14, 2010 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.
Opening claim text (preview).
What is claimed is: 1. A method comprising: (a) providing a substrate having a plurality of through-holes; (b) applying a composition comprising 0.5 to 100 ppm of a zero-valent metal, a stabilizer compound and water; wherein the zero-valent metal is selected from the group consisting of palladium, silver, cobalt, nickel, gold, copper and ruthenium; wherein the stabilizer compound is a compound of formula (I) or formula (II)…
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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