Thermocouple and method of forming a thermocouple on a contoured gas turbine engine component

US8961007B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8961007-B2
Application numberUS-201213417448-A
CountryUS
Kind codeB2
Filing dateMar 12, 2012
Priority dateMar 15, 2011
Publication dateFeb 24, 2015
Grant dateFeb 24, 2015

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Abstract

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A method of forming a thermocouple ( 12 ), including: depositing a first material on a component ( 10 ) to form a first leg ( 14 ); depositing a second material through a mask ( 30 ) to form a pattern ( 50 ) on the component ( 10 ), the pattern ( 50 ) forming a plurality of discrete second leg junction ends ( 20 ) and a continuous patch ( 52 ) of the second material comprising indiscrete lead ends of the second legs ( 16 ), each second leg junction end ( 20 ) spanning from a respective junction ( 18 ) with the first leg ( 14 ) to the continuous patch ( 52 ); and laser-ablating the continuous patch ( 52 ) to form discrete lead ends ( 22 ) of the second legs ( 16 ), each lead end ( 22 ) electrically connected to a respective junction end ( 20 ), thereby forming discrete second legs ( 16 ).

First claim

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The invention claimed is: 1. A method of forming a thermocouple on a contoured gas turbine hot gas path component, the method comprising: depositing a first material on the contoured gas turbine engine hot gas path component to form a first leg of the thermocouple; depositing a second material through a mask to form a pattern of the second material on the component, the pattern forming a plurality of discrete second leg junction ends and a continuous patch of the second material…

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What does patent US8961007B2 cover?
A method of forming a thermocouple ( 12 ), including: depositing a first material on a component ( 10 ) to form a first leg ( 14 ); depositing a second material through a mask ( 30 ) to form a pattern ( 50 ) on the component ( 10 ), the pattern ( 50 ) forming a plurality of discrete second leg junction ends ( 20 ) and a continuous patch ( 52 ) of the second material comprising indiscrete lead e…
Who is the assignee on this patent?
Subramanian Ramesh, Kulkarni Anand A, Sheehan Kevin C, and 1 more
What technology area does this patent fall under?
Primary CPC classification G01K1/026. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).