Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US8960932B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8960932-B2 |
| Application number | US-201213436102-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 30, 2012 |
| Priority date | May 27, 2011 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A light emitting device includes: a substrate having a bar shape; a plurality of light emitting elements separately mounted in a lengthwise direction of the substrate on an upper surface of the substrate; and a light-transmissive cover formed to be upwardly convex, having one or more localized concave portions, and installed on the substrate to cover at least two of the plurality of light emitting elements together.
Opening claim text (preview).
What is claimed is: 1. A light emitting device, comprising: a substrate; a plurality of light emitting elements separately disposed on the substrate; and a light-transmissive cover having an upwardly convex portion and two or more concave portions, and disposed on the substrate to cover at least two of the plurality of light emitting elements together, wherein: the two or more concave portions of the light-transmissive cover are defined at positions corresponding to two or m…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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