Image forming apparatus
US-9193155-B2 · Nov 24, 2015 · US
Liquid droplet ejecting head and printing apparatus
US8960865B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8960865-B2 |
| Application number | US-201314030472-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 18, 2013 |
| Priority date | Sep 27, 2012 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A liquid droplet ejecting head includes: a base substrate that is formed as a plate-like body and that has a concave portion, which is formed to be open toward an upper surface of the plate-like body, and a wiring pattern which is provided inside the concave portion and formed of a conductive material; and an IC package that is fixed to airtightly seal the inside of the concave portion on the upper surface side and is electrically connected to the wiring pattern.
First claim
Opening claim text (preview).
What is claimed is: 1. A liquid droplet ejecting head comprising: a base substrate that is formed as a plate-like body and that has a concave portion, which is formed to be open toward one surface of the plate-like body, and a wiring pattern which is provided inside the concave portion and formed of a conductive material; and an IC package that is electrically connected to the wiring pattern, wherein the IC package has a planar shape, wherein the IC package seals and fixes t…
Assignees
Inventors
Classifications
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B41J2/04501Primary
Operations & Transport · mapped topic
- B41J2/14233Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US8960865B2 cover?
- A liquid droplet ejecting head includes: a base substrate that is formed as a plate-like body and that has a concave portion, which is formed to be open toward an upper surface of the plate-like body, and a wiring pattern which is provided inside the concave portion and formed of a conductive material; and an IC package that is fixed to airtightly seal the inside of the concave portion on the u…
- Who is the assignee on this patent?
- Seiko Epson Corp
- What technology area does this patent fall under?
- Primary CPC classification B41J2/04501. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Feb 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).