Compact ejectable component assemblies in electronic devices

Patent metadata

Field	Value
Publication number	US-8960818-B2
Application number	US-201313914100-A
Country	US
Kind code	B2
Filing date	Jun 10, 2013
Priority date	Apr 25, 2008
Publication date	Feb 24, 2015
Grant date	Feb 24, 2015

Abstract

Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.

First claim

What is claimed is:

1. An ejectable component assembly for use in an electronic device, comprising:
a housing;
a tray movably located within the housing; and
an eject mechanism operable to remove the tray from the housing, the eject mechanism comprising:
an ejection arm operative to contact the tray;
a pivot point for the ejection arm;
an actuating arm coupled to the ejection arm around the pivot point, and
a user contact plate coupled to the actuating, wherein
the tra…

Assignees

• Apple Inc

Inventors

• Myers Scott A
• Wang Erik L
• Sloey Jason S

Classifications

• H04M1/0283

  Electricity · mapped topic

• H04M1/026

  Electricity · mapped topic

• H04B1/3818 Primary

  Electricity · mapped topic

• G06K13/08

  Physics · mapped topic

• H04M2250/14

  Electricity · mapped topic