Circuit board, electronic device, and production method for circuit board
US-12156346-B2 · Nov 26, 2024 · US
Circuit board and electronic device
US8958211B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8958211-B2 |
| Application number | US-201113300701-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2011 |
| Priority date | Jan 25, 2011 |
| Publication date | Feb 17, 2015 |
| Grant date | Feb 17, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic device comprising: an electronic component including a plurality of terminals; and a circuit board on which the electronic component is mounted; wherein the circuit board includes: a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first…
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Frequently asked questions
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- What does patent US8958211B2 cover?
- An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plur…
- Who is the assignee on this patent?
- Hiroshima Yoshiyuki, Matsui Akiko, Sugane Mitsuhiko, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H05K1/18. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).