Light-emitting device
US-12155019-B2 · Nov 26, 2024 · US
Encapsulating sheet, optical semiconductor device, and producing method thereof
US8957451B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8957451-B2 |
| Application number | US-201314079789-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 14, 2013 |
| Priority date | Nov 28, 2012 |
| Publication date | Feb 17, 2015 |
| Grant date | Feb 17, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 μm or more.
First claim
Opening claim text (preview).
What is claimed is: 1. An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, comprising: an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer, wherein the embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8957451B2 cover?
- An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin compositio…
- Who is the assignee on this patent?
- Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification H10H20/854. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).