Coated light emitting device and method for coating thereof

Patent metadata

Field	Value
Publication number	US-8957428-B2
Application number	US-200913120299-A
Country	US
Kind code	B2
Filing date	Sep 21, 2009
Priority date	Sep 25, 2008
Publication date	Feb 17, 2015
Grant date	Feb 17, 2015

Abstract

The present invention relates to the field of a light emitting device ( 1 ), comprising a light emitting diode ( 2 ) arranged on a submount ( 3 ), said device having a lateral circumference surface ( 6 ) and a top surface ( 8 ), and an optically active coating layer ( 7 ), said coating layer ( 7 ):
covering along at least a part of said circumference surface ( 6 ), extending from the submount ( 3 ) to said top surface ( 8 ), and essentially not covering the top surface ( 8 ). A method for producing the device is also disclosed.

First claim

The invention claimed is:

1. A light emitting device comprising a light emitting diode arranged on and above a submount, a substrate above said light emitting diode, a wavelength converting body arranged above said substrate, and an optically active coating layer, said optically active coating layer:
coating along a side surface of the device from the submount to a top surface of the substrate, and
essentially not covering the top surface and not covering said wavelength converting body.

2. A light emitting device according to claim 1 , wherein said optically active coating layer is selected from the group consisting of: reflective, diffusing, spectrally filtering, luminescent, and light blocking coating layers, and combinations thereof.

3. A light emitting device according to claim 1 , further comprising an optical component arranged on said light emitting diode, selected from the group consisting of: a phosphor body, a light transmissive body and a reflecting body, and combinations thereof.

4. A light emitting device according to claim 3 , wherein said reflecting body is arranged so that the light will escape through at least a part of the side surface.

5. A light emitting device according to claim 1 , further comprising an optical component arranged on said light emitting device.

6. A light emitting device according to claim 1 , wherein said coating layer is solid.

7. A light emitting device according to claim 1 , wherein at least part of said side surface includes at least one other coating layer.

8. An array of light emitting devices according to claim 1 .

9. An array of light emitting devices according to claim 8 , wherein said light emitting devices are arranged to share said coating layer.

Assignees

• Jagt Hendrik J B
• Kleynen Christian
• Weijers Aldegonda L
• Koninkl Philips Nv

Inventors

• Jagt Hendrik J B
• Kleynen Christian
• Weijers Aldegonda L

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/90

  Bond pads, in general · CPC title