Conductive multilayer stack, coated substrates including the same, and methods of making the same

Patent metadata

Field	Value
Publication number	US-8956730-B2
Application number	US-201213631773-A
Country	US
Kind code	B2
Filing date	Sep 28, 2012
Priority date	Sep 28, 2012
Publication date	Feb 17, 2015
Grant date	Feb 17, 2015

Abstract

An electrically conductive multilayer stack including a first metal oxide layer including titanium oxide, a metal layer on the first metal oxide layer, and a second metal oxide layer including titanium oxide on the metal layer, at least one of the first metal oxide layer and the second metal oxide layer including a first region, a second region on the first region, and a third region on the second region, the first region and the third region each having a higher oxygen concentration than that of the second region is disclosed. Methods of manufacturing an electrically conductive multilayer stack are also disclosed.

First claim

What is claimed is:

1. An electrically conductive multilayer stack comprising:
first and second metal oxide layers comprising a titanium oxide, the first metal oxide layer comprising a first region comprising a titanium oxide, a second region on the first region and comprising a titanium oxide, and a third region on the second region and comprising a titanium oxide, the first region and the third region each having a higher oxygen concentration than that of the second region, wherein:
the first region has a thickness in a range of about 0.5 to about 6 nm, and/or
the second region has a thickness in a range of about 3 to about 8 nm, and/or
the third region has a thickness in a range of about 0.5 to about 6 nm; and

a metal layer between the first and second metal oxide layers.

2. The electrically conductive multilayer stack of claim 1 , wherein the metal layer comprises gold.

3. The electrically conductive multilayer stack of claim 1 , wherein the second metal oxide layer comprises a first region, a second region on the first region, and a third region on the second region, the first region and the third region each having a higher oxygen concentration than that of the second region.

4. The electrically conductive multilayer stack of claim 1 , wherein the first region has a thickness in a range of about 0.5 to about 6 nm.

5. The electrically conductive multilayer stack of claim 1 , wherein the second region has a thickness in a range of about 3 to about 8 nm.

6. The electrically conductive multilayer stack of claim 1 , wherein the third region has a thickness in a range of about 0.5 to about 6 nm.

7. The electrically conductive multilayer stack of claim 1 , wherein a ratio of a thickness of the first region to a thickness of the second region is in a range of about 0.0625:1 to about 1:1.

8. The electrically conductive multilayer stack of claim 1 , wherein a ratio of a thickness of the third region to a thickness of the second region is in a range of 0.0625:1 to 1:1.

9. The electrically conductive multilayer stack of claim 1 , wherein at least one of the first metal oxide layer and the second metal oxide layer has a total thickness in a range of about 4 to about 15 nm.

10. The electrically conductive multilayer stack of claim 1 , wherein the metal layer has a thickness in a range of about 5 to about 20 nm.

11. An electrically conductive coated transparency comprising a transparency and the electrically conductive multilayer stack of claim 1 on the transparency.

12. The electrically conductive coated transparency of claim 11 , further comprising a topcoat on the electrically conductive multilayer stack, the topcoat comprising a hydrophobic component having a fluorinated carbon backbone and a hydrophilic component having a polyether chain.

13. The electrically conductive coated transparency of claim 11 , further comprising a topcoat on the electrically conductive multilayer stack, the topcoat comprising the reaction product of a hydrophobic precursor having a fluorinated carbon backbone and a hydrophilic precursor having a polyether chain.

14. A method of manufacturing an electrically conductive multilayer stack, the method comprising:
forming a first metal oxide layer comprising a titanium oxide;
forming a metal layer on the first metal oxide layer; and
forming a second metal oxide layer comprising a titanium oxide on the metal layer, at least one of the forming the first metal oxide layer or the forming the second metal oxide layer comprising varying a flow rate of oxygen to form a first region comprising a titanium oxide, a second region on the first region and comprising a titanium oxide, and a third region on the second region and comprising a titanium oxide, the first region and the third region each having a higher oxygen concentration than that of the second region, wherein:
the first region has a thickness in a range of about 0.5 to about 6 nm, and/or
the second region has a thickness in a range of about 3 to about 8 nm, and/or
the third region has a thickness in a range of about 0.5 to about 6 nm.

15. The method of claim 14 , wherein the varying the flow rate of oxygen comprises flowing oxygen at a first oxygen flow rate, then flowing oxygen at a second oxygen flow rate, and then flowing oxygen at a third oxygen flow rate.

16. The method of claim 15 , wherein a ratio of the first oxygen flow rate to the second oxygen flow rate is in a range of 10:1 to 25:1 and a ratio of the third oxygen flow rate to the second oxygen flow rate is in a range of 10:1 to 25:1.

17. The method of claim 15 , wherein the varying the flow rate of oxygen further comprises flowing a first inert gas at a first inert gas flow rate, then flowing a second inert gas at a second inert gas flow rate, and then flowing a third inert gas at a third inert gas flow rate.

18. The method of claim 14 , wherein the forming the first metal oxide layer and the forming the second metal oxide layer each comprise varying the flow rate of oxygen during formation.

19. A method of manufacturing an electrically conductive multilayer stack, the method comprising:
forming a first metal oxide layer comprising titanium oxide;
forming a metal layer on the first metal oxide layer; and
forming a second metal oxide layer comprising titanium oxide on the metal layer, at least one of the forming the first metal oxide layer and the forming the second metal oxide layer comprising forming a first region comprising a titanium oxide, a second region comprising a titanium oxide and a third region comprising a titanium oxide, the first region and third region each having a higher oxygen concentration than the second region, wherein:
the first region has a thickness in a range of about 0.5 to about 6 nm, and/or
the second region has a thickness in a range of about 3 to about 8 nm, and/or
the third region has a thickness in a range of about 0.5 to about 6 nm.

20. The method of claim 19 , wherein the forming the first metal oxide layer comprises sputtering, evaporation, atomic layer deposition, or chemical vapor deposition.

21. An electrically conductive multilayer stack comprising:
first and second metal oxide layers comprising a titanium oxide, the first metal oxide layer comprising a first region having a thickness in a range of about 0.5 to about 6 nm, a second region on the first region, and a third region on the second region, the first region and the third region each having a higher oxygen concentration than that of the second region; and
a metal layer between the first and second metal oxide layers.

22. An electrically conductive multilayer stack comprising:
first and second metal oxide layers comprising a titanium oxide, the first metal oxide layer comprising a first region, a second region on the first region and having a thickness in a range of about 3 to about 8 nm, and a third region on the second region, the first region and the third region each having a higher oxygen concentration than that of the second region; and
a metal layer between the first and second metal oxide layers.

23. An electrically conductive multilayer stack comprising:
first and second metal oxide layers comprising a titanium oxide, the first metal oxide layer comprising a first region, a second region on the first region, and a third region on the second region and having a thickness in a range of about 0.5 to about 6 nm, the first region and the third region each having a higher oxygen concentration than that of t

Assignees

• Ppg Ind Ohio Inc

Inventors

• Uprety Krishna K
• Bimanand Alexander
• Lakdawala Khushroo H

Classifications

• Y10T428/31786

  Of polyester [e.g., alkyd, etc.] · CPC title

• Y10T428/31551

  Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.] · CPC title

• C23C28/3455

  with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer · CPC title

• Y10T428/31663

  As siloxane, silicone or silane · CPC title

• C03C17/42

  at least one coating of an organic material and at least one non-metal coating · CPC title