Helicoil spring backing socket

Patent metadata

Field	Value
Publication number	US-8956193-B2
Application number	US-201213712000-A
Country	US
Kind code	B2
Filing date	Dec 12, 2012
Priority date	Dec 12, 2012
Publication date	Feb 17, 2015
Grant date	Feb 17, 2015

Abstract

Methods of forming a socket assembly and associated structures formed thereby are described. Those methods and structures may include forming a socket assembly comprising a socket body having a plurality of vertical openings, wherein contact assemblies are disposed within individual vertical openings. The contact assemblies comprise a compression spring surrounding an insulated conductive wire.

First claim

What is claimed is:

1. A method of forming a socket assembly comprising:
providing a socket body comprising a plurality of vertical openings; and
inserting a contact assembly within individual vertical openings, wherein the contact assembly comprises a compression spring surrounding an insulated conductive wire.

2. The method of claim 1 further comprising wherein the contact assembly is preassembled prior to insertion into the socket body.

3. The method of claim 1 further comprising wherein a plurality of contact assemblies are inserted into a plurality of vertical openings within the socket body, wherein at least one of the contact assemblies comprises a grounded contact assembly.

4. The method of claim 1 further comprising wherein the compression spring is non-conductive.

5. The method of claim 1 further comprising wherein the contact assembly comprises an insulated braided conductive wire disposed within a helical compression spring, wherein a terminal end of the conductive wire is attached to a spring cap, and a solder end of the conductive wire is attached to a solderball.

6. The method of claim 1 further comprising wherein the socket body comprises a nonconductive socket body that is plated with a conductive material.

7. The method of claim 5 further comprising wherein the solder ball is coupled with a washer.

8. The method of claim 7 further comprising wherein the washer is coated with a conductive material to provide a grounding contact assembly.

9. The method of claim 1 further comprising wherein the compressive spring is pre-loaded.

10. The method of claim 1 further comprising wherein the socket body comprises a metallic socket body.

11. The method of claim 3 further comprising wherein a solder end spring cap is attached to a solder end of the conductive wire of the plurality of contact assemblies.

12. The method of claim 11 further comprising wherein at least one of the solder end spring caps comprises a grounding spring cap.

13. The method of claim 5 further comprising wherein the insulated braided conductive wire comprises less than about 1 mm in diameter.

14. The method of claim 1 further comprising wherein the socket assembly is coupled with a device substrate.

15. The method of claim 14 further comprising wherein the device substrate further comprises a package structure.

16. The method of claim 1 further comprising dispensing solder on a bottom portion of the vertical openings, and then reflowing the solder to attach the compression springs to the socket body.

17. The method of claim 1 further comprising inserting a washer on a bottom portion and an insulator on a top portion of the vertical opening to seal the vertical opening.

18. A socket assembly comprising:
a socket body comprising a plurality of vertical openings; and
a contact assembly disposed within individual vertical openings, wherein the contact assembly comprises a compression spring surrounding an insulated conductive wire.

19. The assembly of claim 18 further comprising wherein the socket assembly comprises a plurality of contact assemblies disposed within the plurality of vertical openings, wherein at least one of the contact assemblies comprises a grounded contact assembly.

20. The assembly of claim 18 further comprising wherein the compression spring is non-conductive.

21. The assembly of claim 18 further comprising wherein the contact assembly comprises an insulated braided conductive wire disposed within a helical compression spring, wherein a terminal end of the conductive wire is attached to a spring cap, and a solder end of the conductive wire is attached to a solderball.

22. The assembly of claim 18 further comprising wherein the socket body comprises a nonconductive socket body comprising a conductive material disposed on an exterior portion of the socket body.

23. The assembly of claim 21 further comprising wherein the solder ball is coupled with a washer.

24. The assembly of claim 23 further comprising wherein the washer is coated with a conductive material to provide a grounding contact assembly.

25. The assembly of claim 18 further comprising wherein the compressive spring is pre-loaded.

26. The assembly of claim 18 further comprising wherein the socket body comprises a metallic socket body.

27. The assembly of claim 19 further comprising wherein a solder end spring cap is attached to a solder end of the conductive wire of the plurality of contact assemblies.

28. The assembly of claim 27 further comprising wherein at least one of the solder end spring caps comprises a grounding spring cap.

29. The assembly of claim 21 further comprising wherein the insulated braided conductive wire comprises less than about 1 mm in diameter.

30. The assembly of claim 18 further comprising a washer disposed on a bottom portion and an insulator disposed on a top portion of the vertical opening capable of sealing the vertical opening.

31. A socket assembly comprising:
a conductive material disposed on a socket housing comprising vertical openings;
a solder on a bottom portion of the vertical openings;
a compression spring disposed within the vertical openings and wherein an end of the compression spring is attached to the solder;
a contact assembly disposed within the compression spring, wherein the contact assembly comprises a compression spring surrounding an insulated conductive wire; and
a spring cap coupled to a terminal end of the conductive wire.

32. The assembly of claim 31 further comprising a device substrate coupled to the socket assembly.

33. The structure of claim 32 further comprising a package structure coupled to the device substrate.

34. The structure of claim 32 wherein the package structure further comprises at least one of a CPU and a memory die.

35. The structure of claim 33 further comprising a system comprising: a bus communicatively coupled to the package structure; and an eDRAM communicatively coupled to the bus.

Assignees

• Tran Donald
• Nekkanty Srikant
• Intel Corp

Inventors

• Tran Donald
• Nekkanty Srikant

Classifications

• H01R43/20 Primary

  for assembling or disassembling contact members with insulating base, case or sleeve · CPC title

• H01R2201/20

  for testing or measuring purposes · CPC title

• H01R13/2421

  using coil springs · CPC title

• H01R13/6599

  Dielectric material made conductive, e.g. plastic material coated with metal · CPC title

• G01R11/00

  Electromechanical arrangements for measuring time integral of electric power or current, e.g. of consumption (monitoring electric consumption of electrically-propelled vehicles B60L3/00) · CPC title