Scalable cooling architecture for liquid and air intake air cooling modules
US-2024138125-A1 · Apr 25, 2024 · US
Air-side economizer facilitating liquid-based cooling of an electronics rack
US8955347B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8955347-B2 |
| Application number | US-201113187561-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 21, 2011 |
| Priority date | Jul 21, 2011 |
| Publication date | Feb 17, 2015 |
| Grant date | Feb 17, 2015 |
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Abstract
Official abstract text for this publication.
A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.
First claim
Opening claim text (preview).
What is claimed is: 1. A cooling apparatus comprising: at least one local cooling wall station separate and free-standing from at least one electronics rack comprising at least one electronic subsystem to be cooled, one electronics rack of the at least one electronics rack being positioned adjacent to a respective local cooling,wall station of the at least one local cooling wall station, the respective local cooling wall station being external to the one electronics rack and the r…
Assignees
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Classifications
- H05K7/20745Primary
Electricity · mapped topic
- H05K7/20136Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8955347B2 cover?
- A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immer…
- Who is the assignee on this patent?
- Campbell Levi A, Chu Richard C, David Milnes P, and 5 more
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20745. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).