Micromechanical angular acceleration sensor and method for measuring an angular acceleration

US8950258B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8950258-B2
Application numberUS-201213479746-A
CountryUS
Kind codeB2
Filing dateMay 24, 2012
Priority dateMay 24, 2011
Publication dateFeb 10, 2015
Grant dateFeb 10, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is arranged in a cutout of the seismic mass. A corresponding method and uses of the sensor are also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A micromechanical angular acceleration sensor for measuring an angular acceleration, comprising: a substrate; a seismic mass defining a cutout; at least one suspension directly engaged to the seismic mass and to the substrate in a deflectable manner; at least one bending beam engaged to the at least one suspension and to the substrate in a deflectable manner; and at least one piezoresistive and/or piezoelectric element configured to measure the angul…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US8950258B2 cover?
A micromechanical angular acceleration sensor for measuring an angular acceleration is disclosed. The sensor includes a substrate, a seismic mass, at least one suspension, which fixes the seismic mass to the substrate in a deflectable manner, and at least one piezoresistive and/or piezoelectric element for measuring the angular acceleration. The piezoresistive and/or piezoelectric element is ar…
Who is the assignee on this patent?
Neul Reinhard, Ohms Torsten, Hattass Mirko, and 2 more
What technology area does this patent fall under?
Primary CPC classification G01P15/0922. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).