Air conditioning system
US-2024384904-A1 · Nov 21, 2024 · US
System and method for cooling power electronics using heat sinks
US8950201B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8950201-B2 |
| Application number | US-201213435653-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 30, 2012 |
| Priority date | Mar 30, 2012 |
| Publication date | Feb 10, 2015 |
| Grant date | Feb 10, 2015 |
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- Title
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Abstract
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A heat pump includes a main refrigerant circuit having a compressor, an indoor heat exchanger, and an outdoor heat exchanger, and a reversing valve. A biflow expansion valve is configured to receive condensed liquid refrigerant and to expand the refrigerant. A cooling circuit in fluid communication with the main refrigerant line includes an expansion device configured to receive a portion of condensed liquid refrigerant from the main refrigerant circuit and to expand the portion of condensed liquid refrigerant. A heat sink is configured to receive the expanded portion of refrigerant from the expansion device. Power electronics are coupled to the heat sink such that the portion of expanded refrigerant from the expansion device passes through the heat sink and cools the power electronics.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat pump comprising: a main refrigerant circuit including a compressor configured to compress a refrigerant, an indoor heat exchanger, an outdoor heat exchanger, a biflow expansion valve configured to receive condensed liquid refrigerant and to expand the refrigerant, a reversing valve movable between a first position that directs refrigerant from the compressor sequentially to the outdoor heat exchanger, the biflow expansion valve, and the indoo…
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Frequently asked questions
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- What does patent US8950201B2 cover?
- A heat pump includes a main refrigerant circuit having a compressor, an indoor heat exchanger, and an outdoor heat exchanger, and a reversing valve. A biflow expansion valve is configured to receive condensed liquid refrigerant and to expand the refrigerant. A cooling circuit in fluid communication with the main refrigerant line includes an expansion device configured to receive a portion of co…
- Who is the assignee on this patent?
- Voorhis Roger J, Trane Int Inc
- What technology area does this patent fall under?
- Primary CPC classification F25B41/20. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Feb 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).