Method of extracting properties of a layer on a wafer
US-2024234216-A9 · Jul 11, 2024 · US
US8949043B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8949043-B2 |
| Application number | US-201013202734-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 2, 2010 |
| Priority date | Feb 27, 2009 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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While an illumination optical system is irradiating the surface of a contaminated standard wafer with illumination light, this illumination light is scanned over the surface of the contaminated standard wafer, then detectors of a detection optical system each detect the light scattered from the surface of the contaminated standard wafer, next a predefined reference value in addition to detection results on the scattered light is used to calculate a compensation parameter “Comp” for detection sensitivity correction of photomultiplier tubes of the detectors, and the compensation parameter “Comp” is separated into a time-varying deterioration parameter “P”, an optical characteristics parameter “Opt”, and a sensor characteristics parameter “Lr”, and correspondingly managed. This makes is easy to calibrate the detection sensitivity.
Opening claim text (preview).
The invention claimed is: 1. A surface inspecting apparatus comprising: a light unit that irradiates with illumination light a surface of a body to be inspected; a scanner that scans the light irradiated from the light unit over the surface of the to-be-inspected body; at least one light detector that detects the light scattered from the surface of the body to be inspected; a processor configured to: use a predefined reference value, as well as a detection result on measuri…
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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