Automated inspection system
US-2024420305-A1 · Dec 19, 2024 · US
Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
US8948495B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8948495-B2 |
| Application number | US-201313783291-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 2, 2013 |
| Priority date | Aug 1, 2012 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
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Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for inspecting a wafer, comprising: acquiring images for multiple die printed on a wafer, wherein each of the multiple die is printed by performing a double patterning lithography process on the wafer, and wherein the multiple die comprise two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple d…
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Physics · mapped topic
Physics · mapped topic
- G06T7/001Primary
Physics · mapped topic
- G06T7/0004Primary
Physics · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8948495B2 cover?
- Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithogr…
- Who is the assignee on this patent?
- Kla Tencor Corp, Kla Tencor Corp
- What technology area does this patent fall under?
- Primary CPC classification G06T7/001. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).