Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US-9223231-B2 · Dec 29, 2015 · US
Exposure method and apparatus measuring position of movable body based on information on flatness of encoder grating section
US8947639B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8947639-B2 |
| Application number | US-201213469828-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 11, 2012 |
| Priority date | Aug 31, 2006 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
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A drive unit drives a wafer stage in a Y-axis direction based on a measurement value of an encoder that measures position information of the wafer stage in the Y-axis direction and based on information on the flatness of a scale that is measured by the encoder. In this case, the drive unit can drive the wafer stage in a predetermined direction based on a measurement value after correction in which a measurement error caused by the flatness of the scale included in the measurement value of the encoder is corrected based on the information on the flatness of the scale. Accordingly, the wafer stage can be driven with high accuracy in a predetermined direction using the encoder, without being affected by the unevenness of the scale.
First claim
Opening claim text (preview).
What is claimed is: 1. An exposure method in which an object is exposed with an energy beam, the method including: mounting the object on a movable body that can move in at least a first and a second directions that are orthogonal within a predetermined plane; and driving the movable body within the predetermined plane, based on measurement information of an encoder system in which one of a grating section and a head unit is arranged on the movable body on which the object is mo…
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Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US8947639B2 cover?
- A drive unit drives a wafer stage in a Y-axis direction based on a measurement value of an encoder that measures position information of the wafer stage in the Y-axis direction and based on information on the flatness of a scale that is measured by the encoder. In this case, the drive unit can drive the wafer stage in a predetermined direction based on a measurement value after correction in wh…
- Who is the assignee on this patent?
- Shibazaki Yuichi, Nikon Corp
- What technology area does this patent fall under?
- Primary CPC classification G03F7/70775. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).