Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Multi-chip package
US8947152B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8947152-B2 |
| Application number | US-201314038363-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 26, 2013 |
| Priority date | Apr 11, 2013 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
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A multi-chip package having a plurality of slice chips coupled through a through-via, at least one slice chip may include an input unit suitable for receiving a slice activation signal, and outputting the slice activation signal to the through-via in response to a slice identification corresponding to the slice chip, a first output unit suitable for outputting the activation signal transferred through the through-via to an internal circuit of the slice chip in response to the corresponding slice identification, and a second output unit suitable for selectively outputting the activation signal transferred through the through-via to the internal circuit of the slice chip in a predetermined activation mode for the multi-chip package.
First claim
Opening claim text (preview).
What is claimed is: 1. A multi-chip package system, comprising: a multi-chip package having a plurality of slice chips coupled each other by using a first through-via and a second through-via, wherein at least one slice chip includes: a first signal transfer unit, and a second signal transfer unit, wherein the first signal transfer unit is suitable for transferring a first slice activation signal to the first through-via and an internal circuit of the slice chip, and the seco…
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- What does patent US8947152B2 cover?
- A multi-chip package having a plurality of slice chips coupled through a through-via, at least one slice chip may include an input unit suitable for receiving a slice activation signal, and outputting the slice activation signal to the through-via in response to a slice identification corresponding to the slice chip, a first output unit suitable for outputting the activation signal transferred …
- Who is the assignee on this patent?
- Sk Hynix Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).