Resin composition and method of producing the same

US8946356B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8946356-B2
Application numberUS-201214130743-A
CountryUS
Kind codeB2
Filing dateJul 5, 2012
Priority dateJul 5, 2011
Publication dateFeb 3, 2015
Grant dateFeb 3, 2015

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  2. Abstract

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Abstract

Official abstract text for this publication.

A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).

First claim

Opening claim text (preview).

What is claimed is: 1. A resin composition, comprising: 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), a proportion of a component having a molecular weight of 30,000 or less, which is determined by gel permeation chromatography (GPC, mobile phase: o-dichlorobenzene, standard substance: polystyrene), is from 3.0 to 5.1% of the entire component (a), a…

Assignees

Inventors

Classifications

  • Chemistry & Metallurgy · mapped topic

  • C08L23/10Primary

    Chemistry & Metallurgy · mapped topic

  • Chemistry & Metallurgy · mapped topic

  • Chemistry & Metallurgy · mapped topic

  • Chemistry & Metallurgy · mapped topic

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What does patent US8946356B2 cover?
A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), t…
Who is the assignee on this patent?
I Shunichiro, Yoshida Koichiro, Miyoshi Takaaki, and 1 more
What technology area does this patent fall under?
Primary CPC classification C08L23/10. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).