Methods of manufacturing semiconductor devices
US-2024332030-A1 · Oct 3, 2024 · US
Electroless copper deposition
US8946087B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8946087-B2 |
| Application number | US-201213364924-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 2, 2012 |
| Priority date | Feb 2, 2012 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
Official abstract text for this publication.
A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is removed without removing metal seed layer on bottoms of features. An electroless deposition of metal is provided to fill the features, wherein the electroless deposition first deposits on the metal seed layer on bottoms of the features.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for providing metal filled features in a layer comprising: depositing a metal seed layer on tops and bottoms of the features; removing the metal seed layer on tops of the features and overhangs and on at least part of the sidewalls within the features without removing any of the metal seed layer on bottoms of features; and providing an electroless deposition of metal to fill the features, wherein the electroless deposition first deposits on th…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W20/054Primary
Electricity · mapped topic
- H10D64/011Primary
Electricity · mapped topic
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- What does patent US8946087B2 cover?
- A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is removed without removing metal seed layer on bottoms of features. An electroless deposition of metal is provided to fill the features, wherein the electroless deposition first deposits on the metal see…
- Who is the assignee on this patent?
- Nalla Praveen Reddy, Lam Res Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W20/054. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).