Semiconductor devices having a seal ring
US-2024413245-A1 · Dec 12, 2024 · US
US8946033B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8946033-B2 |
| Application number | US-201213561352-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2012 |
| Priority date | Jul 30, 2012 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A merged fin finFET and method of fabrication. The finFET includes: two or more single-crystal semiconductor fins on a top surface of an insulating layer on semiconductor substrate, each fin of the two or more fins having a central region between and abutting first and second end regions and opposite sides, top surfaces and sidewalls of the two or more fins are ( 100 ) surfaces and the longitudinal axes of the two or more fins aligned with a [ 100 ] direction; a gate dielectric layer on each fin of the two or more fins; an electrically conductive gate over the gate dielectric layer over the central region of each fin of the of two or more fins; and a merged source/drain comprising an a continuous layer of epitaxial semiconductor material on ends of each fin of the two or more fins, the ends on a same side of the conductive gate.
Opening claim text (preview).
What is claimed is: 1. A method, comprising: (a) forming two or more fins on a top surface of an insulating layer on semiconductor substrate, each fin of said two or more fins being a solid rectangular block of single-crystal semiconductor material, each fin of said two or more fins having a central region between and abutting first and second end regions and opposite sides, top surfaces and sidewalls of said two or more fins are (100) surfaces and the longitudinal axes of said tw…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Answers are generated from the same data shown on this page.