Semiconductor devices and methods of manufacturing thereof
US-2024105795-A1 · Mar 28, 2024 · US
US8946016B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8946016-B2 |
| Application number | US-201313909792-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 4, 2013 |
| Priority date | Dec 16, 2005 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Some embodiments of the present invention include apparatuses and methods relating to NMOS and PMOS transistor strain.
Opening claim text (preview).
What is claimed is: 1. A method comprising: forming a substrate; forming a PMOS transistor on the substrate, wherein the PMOS transistor comprises a first gate structure disposed on a first channel and first stressor, wherein the first stressor comprises an epitaxial source and drain film, and first sidewall spacers disposed adjacent the first gate structure; forming an NMOS transistor on the substrate, wherein the NMOS transistor comprises a second gate structure disposed on…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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