Method for manufacturing a microelectromechanical structure and microelectromechanical structure
US-11975964-B2 · May 7, 2024 · US
Assembling and applying nano-electro-mechanical systems
US8945970B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8945970-B2 |
| Application number | US-44226907-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 21, 2007 |
| Priority date | Sep 22, 2006 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
Official abstract text for this publication.
A method of constructing devices using semiconductor manufacturing processes includes fabricating a device having a movable portion and a fixed portion. The movable portion is connected to the fixed portion only through at least one sacrificial layer. The sacrificial layer is removed in the presence of a force of sufficient strength so as to controllably reposition the movable portion during the release process. The force can be externally applied, generated locally as a result of, for example, the relative positions of the fixed and movable portions, or some combination of the two. Several devices constructed according to such a method are also disclosed.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of constructing devices using semiconductor manufacturing processes, comprising: fabricating a device having a movable portion and a fixed portion, said movable portion being supported by the fixed portion only through at least one sacrificial layer; removing said sacrificial layer so as to completely release said movable portion from all supporting structure in the presence of a non-gravitational force of sufficient strength so as to controllably…
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Operations & Transport · mapped topic
- B81C1/00198Primary
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US8945970B2 cover?
- A method of constructing devices using semiconductor manufacturing processes includes fabricating a device having a movable portion and a fixed portion. The movable portion is connected to the fixed portion only through at least one sacrificial layer. The sacrificial layer is removed in the presence of a force of sufficient strength so as to controllably reposition the movable portion during th…
- Who is the assignee on this patent?
- Carley L Richard, Univ Carnegie Mellon
- What technology area does this patent fall under?
- Primary CPC classification B81C1/00198. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).