Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
LED with thin package struture and method for manufacturing the same
US8945959B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8945959-B2 |
| Application number | US-201313919721-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 17, 2013 |
| Priority date | Jul 6, 2012 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method for manufacturing an LED (light emitting diode) is disclosed wherein a metal substrate is provided. A chip fastening area with a depression and two wire fixing areas on the first metal substrate are defined on the metal substrate. The chip fastening area and the wire fixing areas are separated by a plurality of first grooves. An LED chip is provided in the depression of the chip fastening area and electrically connected to the wire fixing areas by wires. An encapsulant is formed to cover and connect the chip fastening area and the wire fixing areas. Portions of the metal substrate except the chip fastening area and the wire fixing areas are removed.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an LED (light emitting diode), comprising: providing a metal substrate; etching the metal substrate to form a chip fastening area with a depression in the metal substrate, and two wire fixing areas on the metal substrate, a plurality of first grooves being defined between the chip fastening area and the wire fixing areas; providing an LED chip in the depression of the chip fastening area and electrically connected to the two wi…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US8945959B2 cover?
- A method for manufacturing an LED (light emitting diode) is disclosed wherein a metal substrate is provided. A chip fastening area with a depression and two wire fixing areas on the first metal substrate are defined on the metal substrate. The chip fastening area and the wire fixing areas are separated by a plurality of first grooves. An LED chip is provided in the depression of the chip fasten…
- Who is the assignee on this patent?
- Advanced Optoelectronic Tech
- What technology area does this patent fall under?
- Primary CPC classification H10H20/8506. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).