Method for fabricating semiconductor device
US-2016358768-A1 · Dec 8, 2016 · US
US8945818B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8945818-B2 |
| Application number | US-201414266483-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 30, 2014 |
| Priority date | May 2, 2013 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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A method of manufacturing a liquid ejection head, and the method includes a process of providing a first photosensitive resin layer containing a photodegradable positive photosensitive resin and serving as a mold material of the channel on a substrate, a process of providing a gas barrier layer having a film density of 1 g/cm 3 or more on the first photosensitive resin layer, a process of subjecting the first photosensitive resin layer and the gas barrier layer to pattern exposure, and then performing development to thereby form the mold material of a channel and also removing the gas barrier layer before or simultaneously with the development, a process of providing a second photosensitive resin layer on the mold material and the substrate, a process of subjecting the second photosensitive resin layer to pattern exposure, and then performing development, and a process of removing the mold material of the channel.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a liquid ejection head having a substrate and an ejection port formation member in which a liquid channel is formed between the member and the substrate and ejection ports which communicate with the channel and eject liquid are provided, the method comprising: providing a first photosensitive resin layer containing a photodegradable positive photosensitive resin and serving as a mold material of the channel on the substrate; provi…
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