Method of manufacturing liquid ejection head

US8945818B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8945818-B2
Application numberUS-201414266483-A
CountryUS
Kind codeB2
Filing dateApr 30, 2014
Priority dateMay 2, 2013
Publication dateFeb 3, 2015
Grant dateFeb 3, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method of manufacturing a liquid ejection head, and the method includes a process of providing a first photosensitive resin layer containing a photodegradable positive photosensitive resin and serving as a mold material of the channel on a substrate, a process of providing a gas barrier layer having a film density of 1 g/cm 3 or more on the first photosensitive resin layer, a process of subjecting the first photosensitive resin layer and the gas barrier layer to pattern exposure, and then performing development to thereby form the mold material of a channel and also removing the gas barrier layer before or simultaneously with the development, a process of providing a second photosensitive resin layer on the mold material and the substrate, a process of subjecting the second photosensitive resin layer to pattern exposure, and then performing development, and a process of removing the mold material of the channel.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a liquid ejection head having a substrate and an ejection port formation member in which a liquid channel is formed between the member and the substrate and ejection ports which communicate with the channel and eject liquid are provided, the method comprising: providing a first photosensitive resin layer containing a photodegradable positive photosensitive resin and serving as a mold material of the channel on the substrate; provi…

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What does patent US8945818B2 cover?
A method of manufacturing a liquid ejection head, and the method includes a process of providing a first photosensitive resin layer containing a photodegradable positive photosensitive resin and serving as a mold material of the channel on a substrate, a process of providing a gas barrier layer having a film density of 1 g/cm 3 or more on the first photosensitive resin layer, a process of subj…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification G03F7/092. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).