Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
US-2024234132-A1 · Jul 11, 2024 · US
Surface-coated cutting tool
US8945707B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8945707-B2 |
| Application number | US-201113582358-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 5, 2011 |
| Priority date | May 10, 2011 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The surface-coated cutting tool of the present invention is characterized in that a region of 10 μm in a surface of the base material from point a′ to point b′ has two to seven cracks with a width of not more than 200 nm, or two to ten pores are present per length of 10 μm in the surface of the base material from point a′ to point b′, where points a′ and b′ are points defined respectively by lines drawn perpendicularly from points a and b to the surface of the base material where point a is a position located away from an edge ridgeline toward a rake face by distance La and point b is a position located away from the edge ridgeline toward a flank face by distance Lb.
First claim
Opening claim text (preview).
The invention claimed is: 1. A surface-coated cutting tool comprising a base material and a coating formed on the base material, said base material having a hard phase and a binder phase binding the hard phases to each other, said coating being formed of a single layer or a plurality of layers, La being less than 0.2 mm and Lb being less than 0.1 mm, where point a is a position located away from an edge ridgeline toward a rake face by a distance of said La and point b is a pos…
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Classifications
Cross-Sectional Technologies · mapped topic
- C23C16/30Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- B23B27/146Primary
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US8945707B2 cover?
- The surface-coated cutting tool of the present invention is characterized in that a region of 10 μm in a surface of the base material from point a′ to point b′ has two to seven cracks with a width of not more than 200 nm, or two to ten pores are present per length of 10 μm in the surface of the base material from point a′ to point b′, where points a′ and b′ are points defined respectively by li…
- Who is the assignee on this patent?
- Kanaoka Hideaki, Okada Yoshio, Kojima Chikako, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification C23C16/30. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).