A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
Plating method
US8945362B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8945362-B2 |
| Application number | US-31975309-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 12, 2009 |
| Priority date | Apr 26, 2004 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
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Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising generating an electric current through an electrically conductive substrate, electrolyte and anode in electrical communication; and interrupting the current by bringing current density to 0 for an interval of 1 minute within the initial 10 minutes of the copper metal plating cycle with additional interruptions of intervals of 1 minute for every 20 minutes of the copper metal plating cycle, wherein the electric current is direct current.…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- C25D5/18Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US8945362B2 cover?
- Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
- Who is the assignee on this patent?
- Knop Jacek M, Carter John G, Cleary Donald E, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification C25D5/18. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).