Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
Light emitting diode package, method for manufacturing the same and light source unit having the LED package
US8944643B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8944643-B2 |
| Application number | US-59184109-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 2, 2009 |
| Priority date | Feb 17, 2009 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
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Disclosed are a high efficiency LED package with reduced production costs, a method for manufacturing the same, and a light source unit having the LED package. The method for manufacturing the LED package includes preparing a mold frame on which an LED is mounted, forming a hemi-spherical lens having a reverse-conical top part and a lateral part with haze formed by sanding or bead treatment, and fixing the lens to the mold frame to enclose the LED.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an LED package, comprising: preparing a mold frame on which an LED is mounted; forming a unitary hemi-spherical lens including a reverse-conical top central part injected between adjacent two half-circles and a lateral part being another portion except for a top part of the lens; and fixing the lens to the mold frame to enclose the LED, wherein a width of the lens is less than a width of the mold frame such that the entire le…
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Classifications
Electricity · mapped topic
- H10H20/855Primary
Electricity · mapped topic
Mechanical Engineering · mapped topic
Physics · mapped topic
Physics · mapped topic
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- What does patent US8944643B2 cover?
- Disclosed are a high efficiency LED package with reduced production costs, a method for manufacturing the same, and a light source unit having the LED package. The method for manufacturing the LED package includes preparing a mold frame on which an LED is mounted, forming a hemi-spherical lens having a reverse-conical top part and a lateral part with haze formed by sanding or bead treatment, an…
- Who is the assignee on this patent?
- Lee Sun-Hwa, Shin Hyun-Ho, Nah Keon-Soo, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10H20/855. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).