Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US8944580B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8944580-B2 |
| Application number | US-201113510609-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 31, 2011 |
| Priority date | Feb 5, 2010 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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A photosensitive resin composition includes: a cation polymerizable compound; a photoacid generator having an anion portion represented by the chemical formula 1 and a cation portion, wherein R represents a hydrocarbon group which may be substituted with a fluorine atom and has a total carbon number of 1 to 30; X is selected from the group consisting of a carbon atom and a phosphorous atom; Y is selected from the group consisting of —S(═O) 2 —, —O—CF 2 —, —C(═O)—CF 2 —, —O—C(═O)—CF 2 —, —C(═O)—O—CF 2 —, and a single bond; R has at least one fluorine atom when Y is —S(═O) 2 — or the single bond; m and n are integers selected from the group consisting of m+n=3 and n=0, 1, and 2 when X is the carbon atom; m and n are integers selected from the group consisting of m+n=6 and n=0 to 5 when X is the phosphorous atom; and R and Y may be different from each other when m is equal to or greater than 2; and a salt of an anion portion and a cation portion, wherein an acid strength of an acid derived from the anion portion is equal to or greater than that of hexafluorophosphoric acid and equal to or less than that of hexafluoroantimonic acid.
Opening claim text (preview).
The invention claimed is: 1. A photosensitive resin composition comprising: a cation polymerizable compound; and a photoacid generator having an anion portion represented by a chemical formula I and a cation represented by a chemical formula 4, wherein R represents a hydrocarbon group which may be substituted with a fluorine atom and has a total carbon number of 1 to…
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Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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