Electronic device enclosure

US8944529B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8944529-B2
Application numberUS-201313904553-A
CountryUS
Kind codeB2
Filing dateMay 29, 2013
Priority dateAug 8, 2012
Publication dateFeb 3, 2015
Grant dateFeb 3, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic device enclosure includes a chassis, a mounting tray attached to the chassis, a handle rotatably attached to the mounting tray, and a resilient member. The handle includes a securing post. The resilient member includes a first portion, a second portion, and a curling portion connected to the first portion and the second portion. The curling portion is engaged with the securing post. The first portion is engaged with the handle, and the second portion extends out of the handle and abuts the mounting tray. The handle is rotated away from the mounting tray to deform the resilient member, and the resilient member is released to rotate the handle towards the mounting tray.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device enclosure comprising: a chassis comprising a top plate; a clipping member located on the top plate and comprising a resisting portion connected to the top plate, and a supporting portion connected to the resisting portion; an acute angle defined between the resisting portion and the top plate, and the supporting portion being substantially parallel to the top plate; a mounting tray attached to the top plate of the chassis, and a receiv…

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What does patent US8944529B2 cover?
An electronic device enclosure includes a chassis, a mounting tray attached to the chassis, a handle rotatably attached to the mounting tray, and a resilient member. The handle includes a securing post. The resilient member includes a first portion, a second portion, and a curling portion connected to the first portion and the second portion. The curling portion is engaged with the securing pos…
Who is the assignee on this patent?
Hongfujin Prec Ind Wuhan, Hon Hai Prec Ind Co Ltd, Scienbizip Consulting Shenzhen Co Ltd
What technology area does this patent fall under?
Primary CPC classification G06F1/181. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).