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Dissipation utilizing flow of refrigerant
US8944150B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8944150-B2 |
| Application number | US-53553009-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 4, 2009 |
| Priority date | Aug 4, 2008 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion scraping brush provided corresponding to the evaporation portion, the evaporation portion scraping brush being able to sweep relative to an inner surface of the evaporation portion. A refrigerant liquid film is formed on the inner surface of the evaporation portion. Since the fluid refrigerant is uniformly applied to an inner surface of the evaporation portion to form a liquid film, the heat dissipating ability of the heat pipe heat dissipating device is improved, and the heat dissipating uniformity of the heat pipe heat dissipating device is enhanced. A heat dissipating method is also provided.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat dissipating device, comprising: a chamber having an evaporation portion and a condensation portion, wherein: the evaporation portion is operable to have a refrigerant liquid film formed on an inner surface thereof, and the condensation portion is operable to have a refrigerant vapor condense on an inner surface thereof; and a first brush, positioned adjacent to the inner surface of the evaporation portion, configured to sweep the inner surface of th…
Assignees
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Classifications
- H10W40/73Primary
Electricity · mapped topic
Mechanical Engineering · mapped topic
- H01L23/427Primary
Electricity · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
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Frequently asked questions
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- What does patent US8944150B2 cover?
- A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion scraping brush provided corresponding to the evaporation portion, the evaporation portion scraping brush being able to sweep relative to an inner surface of the evaporation portion. A refrigerant liquid film…
- Who is the assignee on this patent?
- Wang Hao, Empire Technology Dev Llc
- What technology area does this patent fall under?
- Primary CPC classification H10W40/73. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).