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PCB stackup having high- and low-frequency conductive layers and having insulating layers of different material types
US8942006B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8942006-B2 |
| Application number | US-201313745780-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 19, 2013 |
| Priority date | Jan 19, 2013 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
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A printed circuit board (PCB) stackup includes conductive layers and insulating layers interleaved among the conductive layers. The conductive layers include one or more power layers, one or more ground layers, one or more high-frequency layers, and one or more low-frequency layers. One or more first signals having one or more first frequencies greater than a first threshold are communicated over the high-frequency layers. One or more second signals having one or more second frequencies less than a second threshold are communicated over the low-frequency layers. Each second frequency is less than each first frequency. The insulating layers include one or more core layers and one or more prepreg layers arranged in alternating fashion. Each insulating layer adjacent to any high-frequency layer has a first material type. Each insulating layer not adjacent to any high-frequency layer has a second material type different than the first material type.
First claim
Opening claim text (preview).
I claim: 1. A printed circuit board (PCB) stack up comprising: a plurality of conductive layers comprising one or more power layers, one or more ground layers, one or more high-frequency layers over which one or more first signals having one or more first frequencies greater than a first threshold specifying a minimum high frequency are communicated, and one or more low-frequency layers over which one or more second signals having one or more second frequencies less than a second…
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Classifications
Electricity · mapped topic
- H05K1/0237Primary
Electricity · mapped topic
Electricity · mapped topic
- H05K3/4688Primary
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US8942006B2 cover?
- A printed circuit board (PCB) stackup includes conductive layers and insulating layers interleaved among the conductive layers. The conductive layers include one or more power layers, one or more ground layers, one or more high-frequency layers, and one or more low-frequency layers. One or more first signals having one or more first frequencies greater than a first threshold are communicated ov…
- Who is the assignee on this patent?
- IBM, Lenovo Entpr Solutions Singapore Pte Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0237. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).