Testing of semiconductor chips with microbumps
US-2015362526-A1 · Dec 17, 2015 · US
Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method
US8941729B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941729-B2 |
| Application number | US-201113082668-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 8, 2011 |
| Priority date | Apr 15, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
Official abstract text for this publication.
An electronic device handling apparatus, which handles an electronic device under test having a first main surface provided thereon with first device terminals and a second main surface provided thereon with second device terminals, includes: a contact arm having a holding-side contact arm to which a first socket is attached and a suction pad which holds the electronic device under test; an alignment apparatus which positions the first socket and the electronic device under test; and the alignment apparatus which positions, with respect to a second socket, the electronic device under test being held by the suction pad and contacting the first socket, wherein the contact arm presses the second device terminals of the electronic device under test to the second socket.
First claim
Opening claim text (preview).
The invention claimed is: 1. An electronic device test method for testing an electronic device under test, the electronic device under test having a first main surface provided thereon with a first device terminal and a second main surface provided thereon with a second device terminal, the electronic device test method comprising: (a) positioning a first socket and the electronic device under test; (b) causing the first socket and the electronic device under test to contact eac…
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Physics · mapped topic
- G01R31/2893Primary
Physics · mapped topic
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- What does patent US8941729B2 cover?
- An electronic device handling apparatus, which handles an electronic device under test having a first main surface provided thereon with first device terminals and a second main surface provided thereon with second device terminals, includes: a contact arm having a holding-side contact arm to which a first socket is attached and a suction pad which holds the electronic device under test; an ali…
- Who is the assignee on this patent?
- Kikuchi Aritomo, Nakamura Hiroto, Advantest Corp
- What technology area does this patent fall under?
- Primary CPC classification G01R31/2893. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).