On-chip terahertz thin-film devices
US-2024429627-A1 · Dec 26, 2024 · US
US8941540B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941540-B2 |
| Application number | US-201013511958-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 25, 2010 |
| Priority date | Nov 27, 2009 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Official abstract text for this publication.
An antenna assembly is disclosed which includes a layered structure having a planar array of antenna elements; and a feed arrangement perpendicular to the antenna elements; the layered structure further having layers over the planar array of antenna elements with holes provided therethrough to allow the feed arrangement to be connected to contacts for the antenna elements. The layered structure may include vias provided such that heat may be applied remotely to the contacts.
Opening claim text (preview).
The invention claimed is: 1. An antenna assembly, comprising: a layered stack structure having a planar array of antenna elements; and a planar multi-layered feed arrangement comprising a plurality of planar feed boards, each provided in a plane that is at an angle to a plane of the antenna elements; wherein the layered stack structure further includes one or more upper layers over the planar array of antenna elements, and wherein holes are provided through the one or more upp…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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