Piezoelectric microelectromechanical resonator device and corresponding manufacturing process
US-2024154599-A1 · May 9, 2024 · US
Piezoelectric module
US8941445B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941445-B2 |
| Application number | US-201313746330-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 22, 2013 |
| Priority date | Jan 23, 2012 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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- Title
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Abstract
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A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles.
First claim
Opening claim text (preview).
What is claimed is: 1. A piezoelectric module, comprising: a piezoelectric package that houses a piezoelectric resonator; and a circuit component package that houses a circuit component configured to generate an oscillation signal at a predetermined frequency based on a vibration signal of the piezoelectric resonator, and the piezoelectric package and the circuit component package are electrically and mechanically bonded, wherein the piezoelectric package comprises: a first d…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8941445B2 cover?
- A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed p…
- Who is the assignee on this patent?
- Nihon Dempa Kogyo Co
- What technology area does this patent fall under?
- Primary CPC classification H03H9/0547. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).