Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US8941293B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941293-B2 |
| Application number | US-201113016295-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 28, 2011 |
| Priority date | May 11, 2006 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Solid state lighting devices containing quantum dots dispersed in polymeric or silicone acrylates and deposited over a light source. Solid state lighting devices with different populations of quantum dots either dispersed in matrix materials or not are also provided. Also provided are solid state lighting devices with non-absorbing light scattering dielectric particles dispersed in a matrix material containing quantum dots and deposited over a light source. Methods of manufacturing solid state lighting devices containing quantum dots are also provided.
Opening claim text (preview).
What is claimed is: 1. A solid state lighting device comprising: a light source; and an active layer deposited either directly or indirectly on top of the light source, the active layer comprising one or more populations of quantum dots dispersed in a first matrix material, wherein the first matrix material comprises a polymer or silicone having a plurality of cross-linked acrylate groups and the polymer or silicone having a plurality of cross-linked acrylate groups comprises a…
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