Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor package including semiconductor chip with through opening
US8941245B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941245-B2 |
| Application number | US-201213533473-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 26, 2012 |
| Priority date | Oct 26, 2011 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor package comprises a substrate having a first opening formed therethrough, a first semiconductor chip stacked on the substrate in a flip chip manner and having a second opening formed therethrough, a second semiconductor chip stacked on the first semiconductor chip in a flip chip manner and having a third opening formed therethrough, and a molding material covering the first semiconductor chip and the second semiconductor chip and filling up a space between the substrate and the first semiconductor chip, a space between the first semiconductor chip and the second semiconductor chip, and filling each of the first opening, the second opening, and the third opening.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor package comprising: a substrate comprising a first opening formed therethrough; a first semiconductor chip stacked on the substrate in a flip chip manner and comprising a second opening formed therethrough; a second semiconductor chip stacked on the first semiconductor ship in a flip chip manner and comprising a third opening formed therethrough; and a molding material covering the first semiconductor chip and the second semiconductor c…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8941245B2 cover?
- A semiconductor package comprises a substrate having a first opening formed therethrough, a first semiconductor chip stacked on the substrate in a flip chip manner and having a second opening formed therethrough, a second semiconductor chip stacked on the first semiconductor chip in a flip chip manner and having a third opening formed therethrough, and a molding material covering the first semi…
- Who is the assignee on this patent?
- Lee Chang-Cheol, Kim Hyun-Jun, Lee In-Young, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/68. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).