Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor device and method of manufacturing thereof
US8941243B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941243-B2 |
| Application number | US-201313768125-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 15, 2013 |
| Priority date | Jun 8, 2012 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A semiconductor device includes a substrate, a plurality of signal lines, and at least one power line. The substrate includes an integrated circuit unit. The signal lines are disposed on the substrate and are configured to provide the integrated circuit unit with signals. The power line is disposed on the substrate and is configured to provide the integrated circuit unit with power supply on the substrate. The power line includes a stacked structure including a first power line and a second power line stacked on the first power line.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a substrate comprising an integrated circuit unit; a plurality of signal lines disposed on the substrate and configured to provide the integrated circuit unit with signals; and at least one power line disposed on the substrate and configured to provide power to the integrated circuit unit, wherein the at least one power line includes a stacked structure comprising a first power line and a second power line stacked on…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8941243B2 cover?
- A semiconductor device includes a substrate, a plurality of signal lines, and at least one power line. The substrate includes an integrated circuit unit. The signal lines are disposed on the substrate and are configured to provide the integrated circuit unit with signals. The power line is disposed on the substrate and is configured to provide the integrated circuit unit with power supply on th…
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/635. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).