Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Power module package and system module having the same
US8941220B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941220-B2 |
| Application number | US-201213484160-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 30, 2012 |
| Priority date | Jun 17, 2011 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
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Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A power module package, comprising: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being vertically coupled with the first substrate such that a side surface in a thickness direction of the second substrate is disposed on an upper surface of the first substrate, wherein the first substrate further comprises a coupling unit electrically conn…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W90/00Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8941220B2 cover?
- Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.
- Who is the assignee on this patent?
- Kim Kwang Soo, Lee Young Ki, Choi Seog Moon, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).