Encapsulated Bulk Acoustic Wave (BAW) Resonator Device
US-2016365843-A1 · Dec 15, 2016 · US
US8941191B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941191-B2 |
| Application number | US-201113193685-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 29, 2011 |
| Priority date | Jul 30, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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A radio frequency microelectromechanical (RF MEMS) device can comprise an actuation p-n junction and a sensing p-n junction formed within a semiconductor substrate. The RF MEMS device can be configured to operate in a mode in which an excitation voltage is applied across the actuation p-n junction varying a non-mobile charge within the actuation p-n junction to modulate an electric field acting upon dopant ions and creating electrostatic forces. The electrostatic forces can create a mechanical motion within the actuation p-n junction. The mechanical motion can modulate a depletion capacitance of the sensing p-n junction, thereby creating a motional current. At least one of the p-n junctions can be located at an optimal location to maximize the efficiency of the RF MEMS device at high resonant frequencies.
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The invention claimed is: 1. A method, comprising: providing a radio frequency microelectromechanical (RF MEMS) device, the device comprising a semiconductor substrate; an actuation p-n junction and a sensing p-n junction, each located within the semiconductor substrate at a point of minimum displacement with respect to a mechanical mode shape; and actuating the actuation p-n junction at a resonant frequency, the actuating causing a mechanical motion in the actuation p-n junct…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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