Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US8941124B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941124-B2 |
| Application number | US-201313968881-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 16, 2013 |
| Priority date | Mar 15, 2011 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, and an inorganic film. The semiconductor layer includes a first surface having an unevenness, a second surface opposite to the first surface, and a light emitting layer. The semiconductor layer includes gallium nitride. The inorganic film is provided to conform to the unevenness of the first surface and in contact with the first surface. The inorganic film has main components of silicon and nitrogen. The inorganic film has a refractive index between a refractive index of the gallium nitride and a refractive index of air. An unevenness is formed also in a surface of the inorganic film.
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What is claimed is: 1. A semiconductor light emitting device, comprising: a semiconductor layer including a first surface having an unevenness, a second surface opposite to the first surface, and a light emitting layer, the semiconductor layer including gallium nitride; a p-side electrode provided on the semiconductor layer; an n-side electrode provided on the semiconductor layer; an inorganic film provided to conform to the unevenness of the first surface and in contact wit…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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