Lid assembly for thermopile temperature sensing device in thermal gradient environment
US-2015380627-A1 · Dec 31, 2015 · US
US8940995B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940995-B2 |
| Application number | US-63240309-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 7, 2009 |
| Priority date | Jul 6, 2009 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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A thermoelectric device is provided. The thermoelectric device includes first and second electrodes, a first leg, a second leg, and a common electrode. The first leg is disposed on the first electrode and includes one or more first semiconductor pattern and one or more first barrier patterns. The second leg is disposed on the second electrode and includes one or more second semiconductor pattern and one or more second barrier patterns. The common electrode is disposed on the first leg and the second leg. Herein, the first barrier pattern has a lower thermal conductivity than the first semiconductor pattern, and the second barrier pattern has a lower thermal conductivity than the second semiconductor pattern. The first/second barrier pattern has a higher electric conductivity than the first/second semiconductor pattern. The first/second barrier pattern forms an ohmic contact with the first/second semiconductor pattern.
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What is claimed is: 1. A thermoelectric device comprising: first and second electrodes; a first leg coupled to the first electrode and including two or more first semiconductor patterns and one or more first barrier patterns; a second leg coupled to the second electrode and including two or more second semiconductor patterns and one or more second barrier patterns; and a common electrode coupled to the first leg and the second leg, wherein the first barrier pattern has a l…
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