Semiconductor device
US-2024290673-A1 · Aug 29, 2024 · US
Manufacturing method of a lead frame
US8940583B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940583-B2 |
| Application number | US-85673010-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 16, 2010 |
| Priority date | Jun 7, 2002 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
Official abstract text for this publication.
In a semiconductor device, a lead frame made of a copper alloy prevents exfoliation occurring near the surface of the lead frame. A copper oxide layer is formed on the base material made of a copper alloy by immersing the base material into a solution of a strong oxidizer. The copper oxide layer serves as an outermost layer and consists of a copper oxide other than a copper oxide in the form of needle crystals.
First claim
Opening claim text (preview).
What is claimed is: 1. A manufacturing method of a lead frame, comprising: configuring a base material made of a copper alloy into a first pattern; applying plating to a part of the base material; and forming a copper oxide layer as an outermost layer on a surface of the base material by immersing the base material into a solution of a strong oxidizer, the copper oxide layer including a copper oxide other than a copper oxide in the form of needle crystals and thickness of the…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8940583B2 cover?
- In a semiconductor device, a lead frame made of a copper alloy prevents exfoliation occurring near the surface of the lead frame. A copper oxide layer is formed on the base material made of a copper alloy by immersing the base material into a solution of a strong oxidizer. The copper oxide layer serves as an outermost layer and consists of a copper oxide other than a copper oxide in the form of…
- Who is the assignee on this patent?
- Yurino Takahiro, Fujitsu Semiconductor Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W74/127. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).