Lid assembly for thermopile temperature sensing device in thermal gradient environment
US-2015380627-A1 · Dec 31, 2015 · US
US8940571B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940571-B2 |
| Application number | US-201313933676-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 2, 2013 |
| Priority date | Dec 26, 2008 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process.
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The invention claimed is: 1. A thermoelectric conversion element comprising: p-type semiconductor blocks and n-type semiconductor blocks alternately arranged in a first direction; a plurality of electrodes connecting the p-type semiconductor blocks and the n-type semiconductor blocks to each other; and a pair of heat transfer plates arranged to hold the p-type semiconductor blocks and the n- type semiconductor blocks therebetween in a second direction orthogonal to the first d…
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